US China Neck to Neck in Patent Applications for Wireless Communications Patent Applications
shot by IP News Shots / 5:52 pm on 23 November, 2020
In a report by Beijing Incopat Co., Ltd. on patent applications for wireless communications technologies, it has been revealed that the US and China are neck to neck with both having 32% of the world’s published patent applications. The third top filer for wireless communications is Japan with 15% filings. Huawei Technologies Co. Ltd. is the highest filer for the wireless patents in China while its US counterpart is Qualcomm Technologies Inc.
Read More at: https://www.natlawreview.com/article/china-and-us-rank-even-wireless-communication-patent-applications-worldwide-through
Industry: Wireless Communication